Thermal overload protection device for electronic components

H - Electricity – 01 – H

Patent

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Details

H01H 79/00 (2006.01) H01T 1/14 (2006.01) H02H 7/20 (2006.01)

Patent

CA 2063771

ABSTRACT OF THE DISCLOSURE A thermal overload protection device for electronic components is disclosed. The device includes a spring-elastic shorting link and a melt element, tripping of the shorting link being performed in dependence of the melting process of the melt element. In order to obtain a SERVO FAIL SALE operation, the tripping and actuating devices are formed as separate components so that the spring force of the actuating device can be made virtually arbitrarily high, without affecting operation of the tripping device.

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