Thermal recording head and process for manufacturing wiring...

Details Thermal recording head and process for manufacturing wiring... Thermal recording head and process for manufacturing wiring...

B - Operations, Transporting

41

M

314/41, 101/43

B41M 5/26 (2006.01) B41J 2/335 (2006.01)

Patent

CA 1237019

THERMAL RECORDING HEAD AND PROCESS FOR MANUFACTURING WIRING SUBSTRATE THEREFOR ABSTRACT OF THE DISCLOSURE A thermal recording head comprising an insulating substrate which has thereon a heat generating resistor pattern made of a thin-film resistor, an electrode pattern having a common power supply electrode pattern portion and a common grounded electrode pattern portion, for supplying the power to the resistor pattern, and a controlling electrode pattern portion, and switching elements for controlling the supply of the power to the resistor pattern. The electrode pattern is made of a thick-film copper paste by a printing process. The operation of the switching elements is controlled by the controlling electrode pattern portion. Also disclosed is a process for manufacturing a wiring substrate for a thermal recording head.

476831

Affiliated with

Also associated with

Rating

Thermal recording head and process for manufacturing wiring... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermal recording head and process for manufacturing wiring..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal recording head and process for manufacturing wiring... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1241084