Thermal vacuum deposition method and device

Details Thermal vacuum deposition method and device Thermal vacuum deposition method and device

C - Chemistry, Metallurgy

23

C

C23C 14/24 (2006.01) C23C 14/56 (2006.01)

Patent

CA 2564256

The invention relates to a thermal vacuum deposition device and method in which a band-shaped substrate is continuously conveyed in a vaporization channel that is charged with a vaporous coating material. The aim of the invention is to allow the substrate to be quickly protected against damage during the coating process in previously known deposition methods and devices. Said aim is achieved by the inventive method, which is characterized in that the vaporization channel is sealed by inserting at least one positionally adjustable hollow element into an outer space of the vaporization channel and an inner space of the vaporization channel when a minimum conveying speed is not attained or when the substrate is at a standstill such that the substrate is located in the inner space.

L'invention concerne un dispositif et un procédé pour le revêtement thermique sous vide d'un substrat en forme de bande transporté en continu dans un conduit de vaporisation alimenté en matériau de revêtement à l'état de vapeur. L'invention vise à fournir, pour les procédés et les dispositifs de revêtement connus, la possibilité d'une protection à mise en oeuvre rapide pour le substrat afin d'éviter la détérioration de ce dernier pendant l'étape de revêtement. Le procédé selon l'invention est caractérisé en ce que, lorsque la vitesse est inférieure à la vitesse de transport minimale ou que le substrat est arrêté, le conduit de vaporisation est séparé, par l'insertion d'au moins un corps creux à position variable, en un espace extérieur du conduit de vaporisation et en un espace intérieur du conduit de vaporisation, de sorte que le substrat se trouve dans l'espace intérieur.

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