Thermally conductive adhesive

C - Chemistry – Metallurgy – 09 – J

Patent

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Details

C09J 9/02 (2006.01) C09J 5/06 (2006.01) C09J 11/04 (2006.01) C09J 201/00 (2006.01) H01L 23/482 (2006.01) H01L 23/498 (2006.01) H05K 3/30 (2006.01) H05K 3/38 (2006.01) H05K 1/02 (2006.01)

Patent

CA 2041807

TITLE Thermally Conductive Adhesive ABSTRACT OF THE DISCLOSURE Adhesive resins are filled with carbon fibers that have a three-dimensional structure. The fibers have variable lengths and widths. The fiber filled adhesive exhibits high thermal conductivity values. Electronic systems having components bonded by a layer of these adhesive resins have high through-the-thickness thermal conductivity. M.7

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