C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
C09J 9/02 (2006.01) C09J 5/06 (2006.01) C09J 11/04 (2006.01) C09J 201/00 (2006.01) H01L 23/482 (2006.01) H01L 23/498 (2006.01) H05K 3/30 (2006.01) H05K 3/38 (2006.01) H05K 1/02 (2006.01)
Patent
CA 2041807
TITLE Thermally Conductive Adhesive ABSTRACT OF THE DISCLOSURE Adhesive resins are filled with carbon fibers that have a three-dimensional structure. The fibers have variable lengths and widths. The fiber filled adhesive exhibits high thermal conductivity values. Electronic systems having components bonded by a layer of these adhesive resins have high through-the-thickness thermal conductivity. M.7
Adams Jerome T.
Yost Bruce A.
Fiberite Inc.
Sim & Mcburney
LandOfFree
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