C - Chemistry – Metallurgy – 09 – K
Patent
C - Chemistry, Metallurgy
09
K
400/7031
C09K 5/00 (2006.01) C08K 3/00 (2006.01) H01L 23/373 (2006.01) H05K 3/30 (2006.01) H05K 1/02 (2006.01)
Patent
CA 1331245
ABSTRACT OF THE INVENTION A thermal conductive polymer composition comprising a mixture of a polymer and a thermally conductive filler material, said filler material having a median particle size of between about 130 to 260 microns and a size distribution characterized by the formula: Image where % represents the wt. % of the particles below or above the median particle size and M represents the median particle size in microns. The thermal conductive polymer composition is characterized by significant thermal conductive (heat dissipation) properties.
585982
Latham Carol Ann
Mcguiggan Michael Francis
Carborundum Company (the)
Gowling Lafleur Henderson Llp
LandOfFree
Thermally conductive ceramic/polymer composites does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thermally conductive ceramic/polymer composites, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermally conductive ceramic/polymer composites will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1290985