C - Chemistry – Metallurgy – 08 – K
Patent
C - Chemistry, Metallurgy
08
K
C08K 3/10 (2006.01) C08K 3/00 (2006.01) C08K 3/04 (2006.01) C08K 3/22 (2006.01) C08K 3/38 (2006.01) C08K 7/00 (2006.01) C08L 101/12 (2006.01) H01B 1/06 (2006.01)
Patent
CA 2352095
A conductive molding composition (100), with a thermal conductivity above 22 W/m°K, is provided. The thermally conductive composition (100) includes a polymer base matrix (12) of, by volume, between 30 and 60 percent. A first thermally conductive filler (116), by volume, between 25 and 60 percent is provided in the composition that has a relatively high aspect ratio of at least 10:1. Also in the composition mixture (100) is a second thermally conductive filler (114), by volume, between 10 and 25 percent that has a relatively low aspect ratio of 5:1 or less.
L'invention concerne une composition de moulage conductrice (100), présentant une conductivité thermique supérieure à 22 W/m DEG K. Ladite composition thermoconductrice (100) est constituée d'une matrice de base polymère (12), à raison de 30 à 60 pour cent en volume. Une première charge thermoconductrice (16), à raison de 25 à 60 pour cent en volume, est prévue dans la composition qui présente un rapport de forme d'au moins 10:1. Par ailleurs, une deuxième charge thermoconductrice (114), présentant un rapport de forme relativement faible de 5 :1 ou moins, est prévue dans la composition composite (100), à raison de 25 à 60 pour cent en volume.
Cool Options Inc.
Fetherstonhaugh & Co.
LandOfFree
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