Thermally conductive foam product

Details Thermally conductive foam product Thermally conductive foam product

H - Electricity

05

K

H05K 7/20 (2006.01)

Patent

CA 2760003

A compressible, thermally conductive foam interface pad is adapted for emplacement between opposed heat transfer surfaces in an electronic device. One heat transfer surface can be part of a heat-generating component of the device, while the other heat transfer surface can be part of a heat sink or a circuit board. An assembly including the foam interface pad and the opposed electronic components is also provided.

L'invention concerne un coussin d'interface en mousse compressible conduisant la chaleur, prévu pour être placé entre des surfaces opposées de transfert de chaleur dans un dispositif électronique. Une des surfaces de transfert de chaleur peut faire partie d'un composant générateur de chaleur du dispositif, tandis que l'autre surface de transfert de chaleur peut faire partie d'un dissipateur de chaleur ou d'une carte de circuit. L'invention concerne également un ensemble comprenant le coussin d'interface en mousse et les composants électroniques opposés.

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