Thermally conductive gel materials

C - Chemistry – Metallurgy – 08 – K

Patent

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257/29, 31/34

C08K 3/00 (2006.01) C08K 3/28 (2006.01) C08L 83/04 (2006.01)

Patent

CA 1314138

ABSTRACT This invention provides new heat transfer materials comprising gels and particulate fillers and having a com- posite heat transfer coefficient greater than 2 watts/m-°K and preferably greater than 15. The materials are easily conformable to irregularly shaped surfaces and have low TO-3 thermal impedance values, e.g., less than 0.5 at 300 psi mounting pressure.

569575

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