Thermally conductive heat curable organopolysiloxane...

Details Thermally conductive heat curable organopolysiloxane... Thermally conductive heat curable organopolysiloxane...

C - Chemistry, Metallurgy

08

K

400/7210, 400/72

C08K 3/34 (2006.01) C08G 77/38 (2006.01) C08L 83/04 (2006.01)

Patent

CA 1268884

THERMALLY CONDUCTIVE HEAT CURABLE ORGANOPOLYSILOXANE COMPOSITIONS Abstract of the Disclosure This invention relates to thermally conductive heat curable organopolysiloxane compositions containing from 30 to 95 percent by weight of filler based on the weight of the composi- tion of which at least 10 percent by weight of the filler is silicon nitride particles.

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