Thermally enhanced electrically insulative adhesive paste

Details Thermally enhanced electrically insulative adhesive paste Thermally enhanced electrically insulative adhesive paste

C - Chemistry, Metallurgy

09

J

C09J 9/00 (2006.01) C09J 11/04 (2006.01)

Patent

CA 2719639

A thermal interface material comprises larger conformable thermally conductive particles, and smaller ceramic thermally conductive particles in a binder. The binder can include thermoplastic (and optionally thermoset) particles and a fugitive liquid which are substantially insoluble in each other. The binder can also include a liquid epoxy. Each of the larger thermally conductive particles is itself a cohesive yet conformable agglomeration of platy particles.

La présente invention concerne un matériau dinterface thermique comprenant des grandes particules thermiquement conductrices conformes, et des petites particules thermiquement conductrices de céramique dans un liant. Le liant peut comprendre des particules thermoplastiques (et facultativement thermodurcissables) et un liquide fugitif qui sont sensiblement insolubles les uns dans les autres. Le liant peut comprendre en outre un époxy liquide. Chacune des grandes particules thermiquement conductrices est elle-même une agglomération cohésive mais conforme de particules lamellaires.

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