Thermally enhanced integrated circuit carrier package

Details Thermally enhanced integrated circuit carrier package Thermally enhanced integrated circuit carrier package

H - Electricity

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356/113

H01L 23/34 (2006.01) H01L 21/48 (2006.01) H01L 23/367 (2006.01) H01L 23/373 (2006.01)

Patent

CA 1238428

THERMALLY ENHANCED INTEGRATED CIRCUIT CARRIER PACKAGE ABSTRACT An integrated circuit carrier package complimented with a mass of highly conductive spherical bodies fused into a semi-random porous lattice matrix. Such component thus resembling a heatsink with generally fin-like structures that are generally arranged diagonally about the base carrier and coated with material(s) which enhance thermal radiation discharge to the surroundings. The carrier package with said intrinsic heatsink thus transmits substantial heat fluxes away from the semiconductor material for enhanced operational domains.

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