Thermocompression bonding using an aluminum-gold intermetallic

Details Thermocompression bonding using an aluminum-gold intermetallic Thermocompression bonding using an aluminum-gold intermetallic

H - Electricity

01

L

H01L 21/447 (2006.01) H01L 21/603 (2006.01) H01L 23/495 (2006.01)

Patent

CA 2139454

A method of bonding a metal or metalized foil to an alumimum contact pad on a semiconductor chip using thermocompression, and devices manufactured using the method. One side of the foil is first coated with a thin barrier layer of chromium and then coated with a thin layer of gold. When the gold layered foil is thereafter thermocompressed onto the contact pad, substantially all of the gold in contact with the alumimum in the contact pad reacts to form AuA12 to thereby bond the foil to the contact pad.

Affiliated with

Also associated with

Rating

Thermocompression bonding using an aluminum-gold intermetallic does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermocompression bonding using an aluminum-gold intermetallic, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermocompression bonding using an aluminum-gold intermetallic will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1712277