Thermoelectric cooling device with efficient heat sink

Details Thermoelectric cooling device with efficient heat sink Thermoelectric cooling device with efficient heat sink

B - Operations, Transporting

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B

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B04B 15/02 (2006.01) F25B 21/02 (2006.01) H01L 23/36 (2006.01)

Patent

CA 1308446

THERMOELECTRIC COOLING DEVICE WITH EFFICIENT HEAT SINK ABSTRACT OF THE DISCLOSURE A thermoelectric cooling design of the type having a nonconducting substrate mounting thermoelectric coolers is improved. Provisions for a flexible can and improved heat dissipation from the thermoelectric coolers are provided. For improved thermal response, the refrig- erated vacuum can is provided with thin walls of high purity aluminum with the result that deformation of the wall surface, especially the bottom wall surface can occur both with respect to installation. A plurality of can heat sinks are placed on the walls of the can to form a unitary and locally rigid side wall to the can at the point of attachment. At least one thermoelectric cooler is communicated to the can heat sinks at a first side for receiving heat energy from the can. A second discharge heat sink is communicated to each thermoelect- ric cooler for dissipating heat energy from both the can and the thermoelectric cooler. Spring biased con- nections move the respective heat sinks towards one another and clamp the thermoelectric cooler firmly there- between. The heat sinks dynamically conform to dimen- sional changes at the cooler interface during installa- tion. The discharge heat sinks are integrally cast with copper plugs placed in an aluminum mold and the aluminum cast about the copper plugs. The copper plug is preferably gold plated to prevent oxidation and form a heat conducting alloy with the aluminum. This enables heat transfer with a low temperature gradient to produce cooling with high efficiency.

566500

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