Thermoelectric device

H - Electricity – 01 – L

Patent

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Details

H01L 35/32 (2006.01) H01L 35/22 (2006.01) H01L 35/30 (2006.01)

Patent

CA 2061105

ABSTRACT OF THE DISCLOSURE A new and improved semiconductor thermoelectric device which could be used either as a thermoelectric cooler or as a thermopile heat sensor with high output voltage. This invention comprises an array of thermocouples fabricated on a semiconductor substrate. The thermocouples comprise segments of tantalum and segments of conductively doped polysilicon as two electric conductor materials of different thermoelectric properties which are buried between two layers of oxide. A layer of metal as a heat collector covers the surface of the thermopile and distributes heat from a nearby heat source.

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