Thermoelectric device and heat sink assembly with reduced...

Details Thermoelectric device and heat sink assembly with reduced... Thermoelectric device and heat sink assembly with reduced...

B - Operations, Transporting

01

L

B01L 7/00 (2006.01) C12M 1/38 (2006.01) G01N 1/44 (2006.01) H01L 35/02 (2006.01) H01L 35/28 (2006.01)

Patent

CA 2687570

An assembly that includes one or more thermoelectric devices and a heat sink and that corrects the problem of an uneven heating effect across the area occupied by the devices due to a lateral heat loss at the edges of the devices or other anomalies among the devices is constructed with a heat sink that contains voids in the slab or flat surface that is in thermal contact with the thermoelectric devices. The voids are located at or within the periphery of the area that is directly aligned with the thermoelectric devices and are concentrated in regions relatively close to the periphery, leaving an area in the center of the slab that is either void-free or of a relatively low void density.

L'invention concerne un ensemble qui comprend un ou plusieurs dispositifs thermoélectriques et un puits thermique et qui corrige le problème de l'effet de chauffage irrégulier sur la zone occupée par les dispositifs dû à une perte de chaleur latérale au niveau des bords des dispositifs ou d'autres anomalies parmi les dispositifs, est construit avec un puits thermique qui contient des vides dans la dalle ou la surface plate qui est en contact thermique avec les dispositifs thermoélectriques. Les vides sont situés à ou dans la périphérie de la zone qui est directement alignée avec les dispositifs thermoélectriques et sont concentrés dans des régions relativement proches de la périphérie, laissant une zone au centre de la dalle qui est soit dépourvue de vide, soit d'une densité de vide relativement faible.

Affiliated with

Also associated with

Rating

Thermoelectric device and heat sink assembly with reduced... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermoelectric device and heat sink assembly with reduced..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermoelectric device and heat sink assembly with reduced... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-2053099