Thermoelectric device exhibiting decreased stress

Details Thermoelectric device exhibiting decreased stress Thermoelectric device exhibiting decreased stress

H - Electricity

01

L

356/97, 322/1.5

H01L 35/10 (2006.01) H01L 35/32 (2006.01)

Patent

CA 1200613

ABSTRACT OF THE DISCLOSURE A thermoelectric device exhibiting both structural integrity and decreased stress across the device notwithstanding the application of thermally cycled temperature differentials there- across includes, electrically interconnected thermoelectric elements and a rigidly affixed substrate. Thermal stress is relieved by using flexible conductors to interconnect the thermo- electric elements, and by the use of a flexible joint to attach a second substrate to the remain- der of the device. Complete elimination of the second substrate may also be used to eliminate stress. Presence of the rigidly affixed substrate gives the device sufficient structural integrity to enable it to withstand rugged conditions.

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