Thermoelectric module

Details Thermoelectric module Thermoelectric module

H - Electricity

01

L

75/68, 356/99

H01L 35/04 (2006.01) B23K 35/30 (2006.01) H01L 35/08 (2006.01) H01L 35/34 (2006.01)

Patent

CA 1081369

ABSTRACT OF THE DISCLOSURE: This invention relates to a method for constructing a thermoelectric module, as well as to the module so obtained. The method according to the invention comprises the steps of cons- tructing a reference shoulder on the semiconductor bar, assembling the semiconductor bars in series by using an insulating cement, cleaning the surfaces, gold plating, nickel plating, brasing copper electrodes machining the regions between the elements which have to remain insulated, protecting the copper electrodes by nickel or chromium plating. The thermoelectric module so obtained consists of a matrix of semiconductor elements with all the mechanical and electrical connections incorporated, including the input and output terminals.

261484

Affiliated with

Also associated with

Rating

Thermoelectric module does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermoelectric module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermoelectric module will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1074724