C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
154/140, 400/651
C08L 27/08 (2006.01) B32B 27/30 (2006.01) C08K 3/32 (2006.01)
Patent
CA 1312986
67616-122 ABSTRACT OF THE DISCLOSURE A vinylidene chloride resin comprising 90 to 99% by weight of vinylidene chloride and 1 to 10% by weight of an acrylic or methacrylic monomer is mixed with 0.5 to 5% by weight, based on the resin, of a combination of a low-molecular-weight plasticizer and a high-molecular-weight plasticizer and 0.2 to 5% by weight, based on the resin, of a condensed phosphoric acid salt. Even if this resin composition is exposed to high temperatures, thermal decomposition of the vinylidene chloride resin is prominently controlled. When this vinylidene chloride resin composition is laminated with a thermoplastic resin having a thermoforming temperature higher than the thermoforming temperature of the vinylidene chloride resin, a packaging resin laminate having an excellent gas-barrier property is obtained.
546132
Kano Fumio
Yamada Muneki
Smart & Biggar
Toyo Seikan Kaisha Ltd.
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