Thermoforming, with applied pressure and dimensional...

Details Thermoforming, with applied pressure and dimensional... Thermoforming, with applied pressure and dimensional...

B - Operations, Transporting

29

C

B29C 65/02 (2006.01) B29C 65/54 (2006.01)

Patent

CA 2645222

A method utilizing elevated temperature and applied pressure to form a layered, composite-material structural panel including (a) establishing a layer-stack assembly in the form of a pre-consolidation expanse having everywhere an independent, location-specific, pre-consolidation local thickness T5 and including at least a pair of confronting, different-thermoformable-material layers, (b) heating the assembly to a thermoform temperature, (c) compressing the heated assembly to create a thermal bond between the two layers, and to consolidate the assembly into a post- consolidation expanse having everywhere an independent, location-specific, post-consolidation, local thickness t which is less than the respective, associated, pre-consolidation local thickness T, and (d) cooling the consolidated assembly to a sub-thermoform temperature to stabilize it in its consolidated condition.

L'invention concerne un procédé utilisant une température élevée et une pression appliquée pour former un panneau structural de matériau composite, stratifié comprenant (a) l'établissement d'un ensemble pile de couches sous la forme d'une étendue de pré-consolidation ayant partout une épaisseur locale de pré-consolidation, indépendante, spécifique à un emplacement T5 et comprenant au moins une paire de couches de matériaux thermoformables différents se faisant face, (b) le chauffage de l'ensemble à une température thermoforme, (c) la compression de l'ensemble chauffé pour créer une liaison thermique entre les deux couches et consolider l'ensemble dans une étendue de post-consolidation ayant partout une épaisseur locale de post-consolidation, indépendante, spécifique à un emplacement t qui est inférieure à l'épaisseur locale de pré-consolidation, associée, respective T , et (d) le refroidissement de l'ensemble consolidé à une température sous-thermoforme pour le stabiliser dans sa condition consolidée.

Affiliated with

Also associated with

Rating

Thermoforming, with applied pressure and dimensional... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermoforming, with applied pressure and dimensional..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermoforming, with applied pressure and dimensional... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1510586