C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
C08G 63/16 (2006.01) C08G 63/20 (2006.01) C08K 5/092 (2006.01) C08K 5/11 (2006.01) C08L 51/08 (2006.01) C08L 67/02 (2006.01) C08L 67/06 (2006.01)
Patent
CA 2045988
23020A - 33- THERMOPLASTIC LOW-PROFILE ADDITIVES AND USE THEREOF IN UNSATURATED POLYESTER RESIN COMPOSITIONS ABSTRACT OF THE DISCLOSURE A low-profile additive composition is disclosed which comprises ethylene glycol, at least one nonpolar diol, adipic acid and trimellitic anhydride. The low-profile additive, when included in an unsaturated polyester resin systems, for use in making sheet molding compositions, provides improved processing characteristics such as viscosity thickening plateau, paste viscosity and phase separation during maturation when the unsaturated polyester.
Ramey Timothy W.
Ross Louis R.
Schiavone Robert J.
Corporation Owens-Corning Fiberglas
G. Ronald Bell & Associates
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