C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/3016, 400/57
C08L 67/02 (2006.01) C08K 3/34 (2006.01) C08L 23/02 (2006.01) C08L 31/04 (2006.01) C08L 33/02 (2006.01)
Patent
CA 1109179
ABSTRACT OF THE DISCLOSURE A thermoplastic molding composition having improved mold release properties is provided, the composition com- prising a thermoplastic resin selected from the group con- sisting of a high molecular weight linear polyester and a high molecular weight block copolyester, from about 0.1 to 4.5% by weight, based on the total composition, of a polyolefin or olefin-based copolymer, and, optionally, from about 0.02 to 0.5% by weight, based on the total composition, of talc.
314470
Company General Electric
Eckersley Raymond A.
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