C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 67/00 (2006.01) C08L 25/00 (2006.01) C08L 25/04 (2006.01) C08L 67/02 (2006.01) C08L 67/03 (2006.01) C08L 71/12 (2006.01) C08L 81/02 (2006.01)
Patent
CA 2042564
O.Z. 0050/41611 Abstract of the disclosure: Thermoplastic molding materials contain A) from 5 to 94.9% by weight of a polyester, B) from 5 to 94.9% by weight of a polyphenylene ether, C) from 0.1 to 50% by weight of a homopolymer or copolymer obtainable by anionic polymerization of a vinylaromatic compound or a diene, or a mixture thereof, carrying primary or secondary amino groups at the chain ends, D) from 0 to 40% by weight of an impact-modifying rubber, E) from 0 to 60% by weight of conventional additives and processing assistants.
Arnold-Mauer Baerbel
Baumgartner Ehrenfried
Bronstert Klaus
Arnold-Mauer Baerbel
Basf Aktiengesellschaft
Baumgartner Ehrenfried
Bronstert Klaus
Robic
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