C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/3038, 400/46
C08L 77/00 (2006.01) C08L 57/00 (2006.01) C08L 71/02 (2006.01) C08L 71/12 (2006.01) C08L 65/00 (2006.01) C08L 67/00 (2006.01)
Patent
CA 2010718
- 23 - O.Z. 0050/40647 Abstract of the Disclosure: Thermoplastic molding materials which are free of cyanuric acid or cyanuric acid derivatives contain as essential components, (A) from 5 to 95% by weight of a toughened polyamide of a1) from 70 to 98% by weight, based on (A), of a polyamide and a2) from 2 to 30% by weight, based on (A), of an emulsion polymer whose particles do not have a hard outer shell, and (B) from 5 to 95% by weight of a functionalized poly- phenylene ether.
Baumgartner Ehrenfried
Mckee Graham E.
Muehlbach Klaus
Basf Aktiengesellschaft
Baumgartner Ehrenfried
Mckee Graham E.
Muehlbach Klaus
Robic Robic & Associes/associates
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