Thermoplastic molding materials of partly aromatic and...

C - Chemistry – Metallurgy – 08 – L

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400/4603, 400/58

C08L 77/06 (2006.01) C08L 77/00 (2006.01) C08L 77/10 (2006.01)

Patent

CA 2015999

Abstract of the Disclosure: Thermoplastic molding materials contain, as essential components, A) from 20 to 98% by weight of a partly aromatic co- polyamide consisting essentially of a1) from 40 to 90% by weight of units which are derived from terephthalic acid and hexa- methylenediamine, a2) from 0 to 50% by weight of units which are derived from .epsilon.-caprolactam and a3) from 0 to 60% by weight of units which are derived from adipic acid and hexamethylenedi- amine, components a2) and/or a3) accounting in total for not less than 10% by weight of the total number of units, B) from 2 to 80% by weight of an amorphous polyamide which differs from A) and furthermore C) from 0 to 50% by weight of a toughened elastomer and D) from 0 to 60% by weight of fibrous or particulate fillers or a mixture thereof.

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