Thermoplastic molding of ceramic powder

Details Thermoplastic molding of ceramic powder Thermoplastic molding of ceramic powder

C - Chemistry, Metallurgy

04

B

25/133, 25/141,

C04B 35/10 (2006.01) C04B 35/18 (2006.01) C04B 35/56 (2006.01)

Patent

CA 1274645

THERMOPLASTIC MOLDING OF CERAMIC POWDER Abstract of the Disclosure A thermoplastically moldable ceramic composition comprised of from about 40% to about 60% by volume of a ceramic powder and a binder comprised of an organic acid and a copolymer of ethylene and from greater than about 12 weight % to about 33 weight % vinyl acetate, said organic acid having a melting point ranging from about 44°C to about 88°C and ranging from greater than about 18% by weight up to about 45% by weight of the binder. The ceramic composition is thermoplastically molded into a body which is baked to remove the binder and then densified to produce a polycrystalline body having a porosity of less than about 20% by volume.

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