Thermoplastic polyamide molding materials having reduced...

Details Thermoplastic polyamide molding materials having reduced... Thermoplastic polyamide molding materials having reduced...

C - Chemistry, Metallurgy

08

L

402/226, 400/783

C08L 77/00 (2006.01) C08K 5/06 (2006.01) C08K 5/1515 (2006.01)

Patent

CA 1271591

Abstract of Disclosure Thermoplastic Polyamide Molding Materials Having Reduced Water Uptake Thermoplastic polyamide molding materials having reduced water uptake are obtained by the addition of 0.3-15% by weight, based on the polyamide, of an epoxide compound containing at least one oxirane group of general formula I Image (I) in which R1 is hydrogen, alkyl, aralkyl or aryl, and R2 is hydrogen, alkyl, dialkyl, aryl, or a group of general formula II Image (II) in which X can be oxygen, sulfur or substituted nitrogen and R3 can be a substituted or non-substituted aromatic, cycloaliphatic, araliphatic or aliphatic group which can also contain further oxirane groups and be interrupted by other groupings. Glycidyl ethers are particularly preferred epoxide compounds. The molding materials of the invention are suitable especially for use in the construction of motor vehicles, instruments, apparatus or machines.

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