C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
C08G 73/10 (2006.01) B32B 15/08 (2006.01) B32B 27/08 (2006.01) C08G 73/16 (2006.01) C08J 5/18 (2006.01)
Patent
CA 2111294
THERMOPLASTIC POLYIMIDE, POLYAMIDE ACID, AND THERMALLY FUSIBLE LAMINATED FILM FOR COVERING CONDUCTIVE WIRES ABSTRACT The invention provides novel thermoplastic polyimide featuring solid adhesive property under low temperature, low hygroscopic coefficient, and solid resistivity to radioactive rays. At the same time, the invention also provides novel polyamide acid which is substantially precursor of the thermo- plastic polyimide, and in addition, the invention also provides novel thermally fusible laminated film for covering conductive wires, featuring solid adhesive property under low temperature, solid resistivity to radioactive rays, and distinct suitability for covering superconductive wires in particular. The novel thermoplastic polyimide is represented by general formula (1) corresponding to the chemical structure shown below; Image (1) - 1 - wherein, Ar, , Ar2 , Ar4 , and Ar6 , respectively designate divalent organic radical, whereas Ar3 and Ar5 respectively designate quadrivalent organic radical, wherein, 1, m, and n, respectively designate positive integer 0 or 1 or more than 1, wherein the sum of 1 and m aggregates 1 or more than 1, and wherein t designates positive integer of 1 or more than 1. The novel thermally fusible laminated film suited for covering conductive wires according to invention comprises poly- imide film and layer of welding agent mainly comprising thermo- plastic resin by way of laminating them with each other. In particular, the welding agent mainly comprises thermoplastic polyimide resin containing less than 220 ° C. of softening point æ represented by the general formula (1) specified above.
Danno Kazuhisa
Furutani Hiroyuki
Ida Junya
Nagano Hirosaku
Nojiro Hitoshi
Goudreau Gage Dubuc
Kanagafuchi Kagaku Kogyo Kabushiki Kaisha
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