C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 53/00 (2006.01) C08L 23/12 (2006.01) C08L 23/16 (2006.01) C08L 53/02 (2006.01)
Patent
CA 2149461
A thermoplastic polymer composition comprises 100 parts by weight of polypropylene, 5 to 100 parts by weight of a hydrogenated block copolymer which has at least one block A and at least one block B , or has at least one block A, at least one block B and at least one block C each indicated below and which has a number average molecular weight of not higher than 700,000, and the block C consists essentially of a polymer of isoprene and butadiene at a ratio by weight of 0:100 to 100:0 and has a number average molecular weight of not higher than 200,000 and a vinyl bond content of not less than 40%, and 0 to 100 parts by weight of an ethylene/propylene rubber. Block A: a butadiene polymer having a number average molecular weight of 2,500 to 200,000 and a vinyl bond content of not higher than 20% Block B: a polymer of isoprene and butadiene at a ratio by weight of 30:70 to 100:0 and has a number average molecular weight of 30,000 to 300,000 and a vinyl bond content of not higher than 20% Block C: a polymer of isoprene and butadiene at a ratio by weight of 0:100 to 100:0 and has a number average molecular weight of not higher than 200,000 and a vinyl bond content of not less than 40%
Hirayama Yoshio
Maeda Mizuho
Nakata Hiromichi
Nishikawa Makoto
Takamatsu Hideo
Hirayama Yoshio
Kirby Eades Gale Baker
Kuraray Co. Ltd.
Maeda Mizuho
Nakata Hiromichi
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