Thermoplastic resin-coated metallic substrate and the method...

B - Operations – Transporting – 29 – F

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117/142, 18/774,

B29F 3/10 (1980.01)

Patent

CA 1090079

ABSTRACT OF THE DISCLOSURE A metallic substrate and an outer thermoplastic resinous coating are bonded to one another by a resinous polyamide hot melt adhesive prepared by condensation of an unpolymerized amide-forming dicarboxylic- containing compound or polymeric fatty acid with a diamine of the formula: Image wherein each of R4, R5, R6 and R7 is a hydrogen atom or an alkyl radical; X is a nitrogen atom or a carbon atom bearing a single hydrogen substituent and n is an integer of from 1 to 6 inclusive. The adhesive is first applied to the metal substrate with sequential deposition of the thermoplastic resinous outer coating.

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