Thermoplastic resin composition

C - Chemistry – Metallurgy – 08 – L

Patent

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400/4506

C08L 67/02 (2006.01) C08L 63/00 (2006.01) C08L 77/00 (2006.01)

Patent

CA 1333430

Disclosed is a thermoplastic resin composition which comprises [A] 100 parts by weight of a resin mixture consisting essentially of not less than 10 wt.% of polyarylate resin, not less than 20 wt.% of polyamide resin and 3 to 60 wt.% of poly- ethylene terephthalate resin, and [B] from 0.1 to 15 parts by weight of an epoxy resin of the following formula: Image Image (wherein X is direct bond, lower alkylene, lower alkylidene, -SO2-, -O-, -S-, - Image - , -C(CN)2- or - Image - , where a part or all of the hydrogen atoms may be substituted by halogen atoms when X is a hydrocarbon atom, R's are each hydrogen, halogen, or lower alkyl, and n is an integer of at least 1). The thermoplastic resin compositions of the invention have good impact strength along with good heat and solvent resistances and good moldability.

616518

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