C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/4506
C08L 67/02 (2006.01) C08L 63/00 (2006.01) C08L 77/00 (2006.01)
Patent
CA 1333430
Disclosed is a thermoplastic resin composition which comprises [A] 100 parts by weight of a resin mixture consisting essentially of not less than 10 wt.% of polyarylate resin, not less than 20 wt.% of polyamide resin and 3 to 60 wt.% of poly- ethylene terephthalate resin, and [B] from 0.1 to 15 parts by weight of an epoxy resin of the following formula: Image Image (wherein X is direct bond, lower alkylene, lower alkylidene, -SO2-, -O-, -S-, - Image - , -C(CN)2- or - Image - , where a part or all of the hydrogen atoms may be substituted by halogen atoms when X is a hydrocarbon atom, R's are each hydrogen, halogen, or lower alkyl, and n is an integer of at least 1). The thermoplastic resin compositions of the invention have good impact strength along with good heat and solvent resistances and good moldability.
616518
Takemura Kazuya
Wakui Tadahiro
Yoshino Kenji
Kawasaki Steel Corporation
Smart & Biggar
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