C - Chemistry – Metallurgy – 08 – K
Patent
C - Chemistry, Metallurgy
08
K
400/7032
C08K 7/22 (2006.01) C08K 7/28 (2006.01)
Patent
CA 1283238
65702-235 Abstract of the Disclosure A thermoplastic resin composition comprises a thermoplastic resin and a spherical, hollow filler having a wall thickness ratio of 2.5 to 10, defined as a ratio of an outer diameter of the filler to a wall thickness of the filler. The composition is useful for producing a light-weighted molded piece without the hollow filler being broken during molding operation.
505831
Sugita Michiyuki
Takahashi Katsuhiko
Polyplastics Co. Ltd.
Smart & Biggar
Sugita Michiyuki
Takahashi Katsuhiko
LandOfFree
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