C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/3008
C08L 79/08 (2006.01) C08L 83/10 (2006.01)
Patent
CA 1317048
ABSTRACT OF THE DISCLOSURE THERMOPLASTIC RESIN COMPOSITION There is disclosed a thermoplastic resin composition comprising a polyether imide resin (A) and an aromatic polyester- polyorganosiloxane block copolymer (B), the weight ratio of A to B (A/B) being 1/9 to 9/1. The polyether imide resin (A) used in the present invention consists preferably of recurring units represented by the formula: Image wherein R1 and R2 are independently a divalent organic groupO The aromatic polyester segment of the copolymer B is preferably one which comprises, as its main constituent, an aromatic polyester (I) comprising an aromatic dicarboxylic acid(s) and a dihydric phenol(s), an aromatic polyester II comprising an aromatic dicarboxylic acid(s) and a lower aliphatic diol(s) or an alicyclic diol, an aromatic polyester (III) comprising an aromatic hydroxycarboxylic acid( 9 ), or an aromatic polyester (IV) comprising two or more copolymers selected from (I), (II) and (III). The preferred polyorganosiloxane segment of the copolymer B is represented by the formula: Image Image R4 n R4 wherein R3 and R4 are independently a methyl group or a phenyl group, Q and Q' are independently a divalent organic group, and n is an integer of 10 or more, Q which is the binding portion to the aromatic polyester segment, is an oxygen atom, -?-R8 or -O- Rg- in which R8 and R9 are independently a lower alkylene group or a lower alkylene ether group, and Q' is an oxygen atom, -R8-N or -Rg-O- in which R8 and R9 are as defined above. H
578712
Mori Hiroshi
Nakata Akira
Suehiro Misayo
Yamamoto Naoki
Finlayson & Singlehurst
Mitsubishi Rayon Co. Ltd.
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