C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/3029
C08L 71/12 (2006.01) C08L 53/02 (2006.01) C08L 77/00 (2006.01)
Patent
CA 1308830
ABSTRACT A thermoplastic resin composition substantially constituted of (A) 25 to 70 % by weight of a polyamide, (B) 25 to 70 % by weight of a polyphenylene ether and (C) 2 to 25 % by weight of a block copolymer having at least one polymer block mainly comprised of a vinyl aromatic compound and at least one polymer block mainly comprised of a conjugated diene compound having the content of the vinyl aromatic compound in the range of 25 to 85 % by weight; wherein the polyamide forms a continuous phase, and, in the continuous phase, the polyphenylene ether is dispersed to form a dispersed phase having an average particle diameter ranging from 0.5 to 10 µm, and further, substantially all of the block copolymer is micro-dispersed in the dispersed phase of the polyphenylene ether. The composition is useful for outerplate materials or wheel caps of automobiles, and for electrical or electronic parts, especially connectors used for example automobiles.
525654
Harada Hiroshi
Kasai Koji
Ueda Sumio
Yoshida Kazuo
Asahi Kasei Kogyo Kabushiki Kaisha
Ridout & Maybee Llp
LandOfFree
Thermoplastic resin composition does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thermoplastic resin composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermoplastic resin composition will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1322408