C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/4603
C08L 77/00 (2006.01) C08K 5/00 (2006.01) C08L 71/12 (2006.01) C08L 71/00 (2006.01) C08L 75/00 (2006.01) C08L 81/00 (2006.01)
Patent
CA 1301983
ABSTRACT THERMOPLASTIC RESIN COMPOSITION A novel thermoplastic resin composition comprising a matrix of polyamide resin (E) and a disperse phase of a composition (D), said composition (D) comprising a polyphenylene ether (A), a rubber- like material (B) and a mutual compatibilizer (C), said polyphenylene ether (A) being obtained from at least one phenol compound represented by the formula: Image wherein R1, R2, R3, R4 and R5 represent a hydrogen atom, a halogen atom or a substituted or unsubstituted hydrocarbon residue, with a proviso that at least one of them is a hydrogen atom, and said polyphenylene ether (A) having a reduced viscosity ?sp/c of 0.40 - 0.58 deciliter/gram, said mutual compatibilizer (C) being compatible or reactive with said polyphenylene ether and reactive with said polyamide resin, and said polyamide resin (E) having a number average molecular weight of 14,000 - 40,000 and an end amino group content of 50 - 95 mmole/kg, wherein the thermo- plastic resin composition constitutes 1 - 65 wt.% of said polyphenylene ether (A), 1 - 20 wt.% of said rubber-like material (B), 0.01 - 5 wt.% of said mutual compatibilizer (C) and 35 - 97.99 wt.% of said poly- amide resin (E), based on the total weight of said thermoplastic resin composition, and the weight average particle size of said disperse phase is 2 micron or less.
569252
Abe Hiroomi
Hosoda Satoru
Nishio Taichi
Okada Takayuki
Sanada Takashi
Bull Housser & Tupper Llp
Sumitomo Chemical Company Limited
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