Thermoplastic resin composition

C - Chemistry – Metallurgy – 08 – L

Patent

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Details

400/3036, 400/30

C08L 71/12 (2006.01) C08L 53/02 (2006.01) C08L 77/00 (2006.01)

Patent

CA 1326721

Abstract of the Disclosure A novel thermoplastic resin composition is disclosed, which comprises a polyphenylene ether, a polyamide and a specific block copolymer as main components and has a specific dispersion morphology such that the polyamide forms a continuous phase in which the polyphenylene ether is dispersed and the block copolymer is micro-dispersed in the dispersed phase of the polyphenylene ether. The composition of the present invention has an excellent balance of thermal stability, heat distortion resistance, impact resistance, oil resistance, stiffness, etc., and, hence, is useful as an engineering material in the fields of automobiles, electric and electronic industries. - 76 -

570232

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