C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/3080
C08L 51/06 (2006.01) C08L 25/08 (2006.01)
Patent
CA 2040540
ABSTRACT OF THE DISCLOSURE A thermoplastic resin composition for molding, having an improved compatibility of polyolefins with aromatic vinyl polymers, superior strength at welded part, stiff- ness, dimensional stability and chemical resistance, and a fiber-reinforced thermoplastic resin composition having inhibited a warpage deformation at the time of molding besides the above superior physical properties are provided, the former composition being obtained by melt- kneading the following components (A) and (B), each in a specified proportion: (A) a modified polyolefin obtained by graft-reacting a polyolefin with an unsaturated carboxylic acid or its anhydride, alone or a mixture of the above polyolefin with a polyolefin, the content of the functional group of the acid or its anhydride and the MFR being both specified, and (B) an epoxy group-containing aromatic vinyl polymer having a specified epoxy group content, alone or a mixture of the vinyl polymer with an aromatic vinyl polymer con- taining no epoxy group, the epoxy group content as the whole of the component (B) and the MFR thereof being both specified, and the latter fiber-reinforced composition being obtained by melt-kneading the above components (A) and (B), together with a fibrous filler in 5 to 150 parts by weight based upon 100 parts by weight of the total weight of the components (A) and (B).
Saito Kouichi
Yonaiyama Rikio
Yoshimitsu Minoru
Chisso Corporation
Macrae & Co.
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