C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 77/00 (2006.01) C08L 21/00 (2006.01) C08L 23/02 (2006.01) C08L 67/02 (2006.01) C08L 23/16 (2006.01)
Patent
CA 2041083
ABSTRACT OF DISCLOSURE A thermoplastic resin composition containing a polyamide resin composition (C) consisting of a polyamide resin (A) and another thermoplastic resin (B) and at least one modifier (D) is excellent in coatability, mechanical properties, linear expansion coefficient and appearance, can be molded into an article which comprises the polyamide resin (C), wherein the ratio of the percent occupied area of the polyamide resin on the surface of the article to the weight percentage of the polyamide in the polyamide resin composition (C) is not less than 1.2, and/or the ratio of the percent concentration of the polyamide resin on the surface of the article determined on the basis of the nitrogen concentration on the surface of the article to the weight percentage of the polyamide in the polyamide resin composition (C) is not less than 1,2, which article is suited for electric and electronic parts and automobile parts such as a bumper, fender and wheel cover.
Abe Hiroomi
Fujii Takeshi
Hosoda Satoru
Kojima Keitaro
Mitsui Kiyoshi
Marks & Clerk
Sumitomo Chemical Co. Ltd.
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