Thermoplastic resin composition and method for preparing the...

C - Chemistry – Metallurgy – 08 – L

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400/3021

C08L 51/00 (2006.01) C08L 51/08 (2006.01) C08L 77/00 (2006.01) C08L 81/02 (2006.01)

Patent

CA 2028054

ABSTRACT OF THE DISCLOSURE A thermoplastic resin composition is here disclosed which contains (I) 99 to 1% by weight of a polyamide resin, (II) 1 to 99% by weight of a polyarylene sulfide resin and, (III) 0.1 to 100 parts by weight, based on 100 parts by weight of the aforesaid resins (I) + (II), of a multi-phase structure thermoplastic resin which is composed of 5 to 95% by weight of an epoxy group- containing olefin copolymer and 95 to 5% by weight of a vinyl polymer or copolymer obtained from at least one kind of vinyl monomer, either of both the components being in the state of a dispersion phase having a particle diameter of 0.001 to 10 µm. Furthermore, a method for preparing the above resin composition is also disclosed herein.

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