C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 77/00 (2006.01) C08F 255/02 (2006.01) C08F 255/08 (2006.01) C08F 279/00 (2006.01) C08F 283/14 (2006.01) C08K 5/13 (2006.01) C08K 5/372 (2006.01) C08L 33/02 (2006.01) C08L 51/04 (2006.01) C08L 51/06 (2006.01) C08L 51/08 (2006.01) C08L 77/06 (2006.01)
Patent
CA 2091961
The thermoplastic resin composition of the present invention comprises (A) polyamide having a melting point of not lower than 280 °C, particularly preferably (A-1) specific polyamide having a melting point of higher than 300 °C, (B) a specific modified polymer, (C) a hindered phenol type antioxidant having a molecular weight of not less than 500 and a TGA 10 % weight loss temperature of not lower than 300 °C, and (D) a sulfur type antioxidant having a molecular weight of not less than 600 and a TGA 10 % weight loss temperature of not lower than 280 °C. The molded product of the present invention is made of the above-mentioned thermoplastic resin composition. The thermoplastic resin composition of the invention is excellent in heat stability.
Amimoto Yoshikatsu
Ikejiri Fumitoshi
Sugiyama Kazuto
Toyota Akinori
Yamamoto Sanehiro
Mitsui Chemicals Inc.
Smart & Biggar
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