Thermoplastic resin composition and use thereof

C - Chemistry – Metallurgy – 08 – L

Patent

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Details

C08L 51/04 (2006.01) C08L 51/06 (2006.01) C08L 77/00 (2006.01) C08L 77/06 (2006.01)

Patent

CA 2056631

Disclosed is a thermoplastic resin composition comprising (A) an aromatic polyamide comprising dicarboxylic acid units comprising 50-100 mol% of units derived from terephthalic acid, and 0-50 mol% of units derived from an aromatic dicarboxylic acid other than terephthalic acid and/or an aliphatic dicarboxylic acid having 4-20 carbon atoms, and diamine units derived from an aliphatic diamine and/or an alicyclic diamine, said aromatic polyamide having an intrinsic viscosity of 0.5-3.0 dl/g as measured in conc. sulfuric acid at 30°C and a melting point of higher than 300°C, (B) a graft modified .alpha.-olefin polymer, and/or a graft modified aromatic vinyl hydrocarbon/conjugated diene copolymer or hydrogenated product thereof, and (C) an aliphatic polyamide, wherein said thermoplastic resin composition comprises 10-80 parts by weight of the graft modified .alpha.-olefin polymer, and/or the graft modified aromatic vinyl hydrocarbon/conjugated diene copolymer or hydrogenated product thereof (B) and 5-80 parts by weight of the aliphatic polyamide (C), based on 100 parts by weight of the aromatic polyamide (A).

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