C - Chemistry – Metallurgy – 08 – K
Patent
C - Chemistry, Metallurgy
08
K
400/5906
C08K 3/00 (2006.01) C08G 59/50 (2006.01) C08K 5/34 (2006.01) C08K 7/00 (2006.01) C08L 63/02 (2006.01)
Patent
CA 1144292
D-1,761 C-2966 THERMOSET IMIDAZOLE CURED EPOXY- POLYSULFIDE RUBBER AUTOMOTIVE BODY SOLDER Abstract of the Disclosure: In a preferred embodiment, a spreadable, thermo- setting automotive body solder is comprised of 100 parts of an epoxy resin adduct of epichlorohydrin and bisphenol A, 25 to 40 parts liquid polysulfide rubber, 0.02 to 0.06 moles of an imidazole curing agent substituted in the 2-position with a hydrocarbon group, and a filler system consisting of 5 to 20 parts aluminum powder, 10 to 20 parts ion-exchanged clay, 3 to 6 parts wetting agent for the clay, and 70 to 130 parts fibrous or plate talc average particle size 3 microns or less. The composition is wordable for several hours at room temperatures but cures in a few minutes at temperatures over 100° C, The filler system provides the body solder with thixotropic properties at room temperatures, and sag resistance in both the cured and uncured states at temperatures up to 200° C. The solder is corrosion resistant without other additives.
328558
Atkins Richard P.
Dearlove Thomas J.
Gray Richard K.
General Motors Corporation
Gowling Lafleur Henderson Llp
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