Thermosettable composition

C - Chemistry – Metallurgy – 08 – L

Patent

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117/183, 400/400

C08L 87/00 (2006.01) B05D 7/24 (2006.01) C08J 5/24 (2006.01) C08J 7/04 (2006.01) C08L 63/00 (2006.01) C08L 101/00 (2006.01) H05K 1/03 (2006.01) H05K 3/28 (2006.01)

Patent

CA 2032921

ABSTRACT OF THE DISCLOSURE A thermosettable resin composition having a viscosity that decreases during processing temperatures and increases as the temperature is raised to curing temperatures is provided. The composition comprises thermosettable resins and thermoplastic particles that are insoluble in the thermosettable resins at processing temperatures but soluble in the thermosettable resins at curing temperatures. Prepregs prepared from the thermosettable resin composition are also provided.

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