C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
154/141, 400/400
C08L 29/04 (2006.01) B32B 15/08 (2006.01) C08L 63/00 (2006.01) C09J 123/08 (2006.01) C09J 163/00 (2006.01)
Patent
CA 1184339
Abstract of the Disclosure A thermosetting adhesive composition is disclosed which contains (a) a half-ester product of a saponified ethylene/vinyl ester copolymer with a dicarboxylic acid and (b) a solid or liquid epoxy resin, and this composition may further optionally contain a compound bearing two or more carboxyl groups. The composition is useful as a structural adhesive and has a good storage stability and good solubility in solvents. It can be cured at relatively low temperatures in a shortened time. After curing, the composition shows good heat-resistance and has good adhesive properties.
394810
Doura Fumihiro
Morimoto Taiji
Nakabayashi Masamitsu
Fetherstonhaugh & Co.
Takeda Chemical Industries Ltd.
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