C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/7326, 400/79
C08L 63/00 (2006.01) C08K 3/34 (2006.01) C08K 5/092 (2006.01) C09D 5/03 (2006.01) C09D 163/00 (2006.01)
Patent
CA 1329856
ABSTRACT OF THE DISCLOSURE A thermosetting epoxy resin based powder composition composed of an epoxy resin, a high-melting point polycarboxylic acid anhydride and a filler, the high-melting point polycarboxylic acid anhydride comprising fine particles of no more than 149 µm in average size that have reacted with the epoxy resin in the molten state on their surfaces.
568485
Kitagawa Katugi
Shinozuka Akira
Riches Mckenzie & Herbert Llp
Somar Corporation
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