Thermosetting epoxy resin composition and thermosets therefrom

Details Thermosetting epoxy resin composition and thermosets therefrom Thermosetting epoxy resin composition and thermosets therefrom

C - Chemistry, Metallurgy

08

G

402/263, 402/274

C08G 59/50 (2006.01) C08G 59/56 (2006.01) C08J 5/24 (2006.01) C08L 63/00 (2006.01) H05K 1/03 (2006.01)

Patent

CA 1246294

THERMOSETTING EPOXY RESIN COMPOSITIONS AND THERMOSETS THEREFROM Abstract of the Disclosure Described are novel thermosetting epoxy resin composi- tions suitable for making cured resins, prepregs and stiff, tough thermoset composites. The thermosetting compositions comprise a polyepoxide component, an amine hardener and a specified amount of certain aromatic oligomers containing functional groups which are reactive with the polyepoxide and/or hardener under curing conditions for the composition. The cured resins have a multiphase morphology which comprises at least one glassy continuous phase and at least one glassy discontinuous phase and have a fracture toughness, KIC, of at least 1.0 MPam1/2.

501997

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