Thermosetting organopolysiloxane compositions

C - Chemistry – Metallurgy – 08 – K

Patent

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Details

400/7224, 400/72

C08K 5/36 (2006.01) C08K 5/39 (2006.01) C08L 83/04 (2006.01)

Patent

CA 1132744

ABSTRACT OF THE DISCLOSURE Organopolysiloxane compositions which are stable at room temperature, but are curable when subjected to elevated temperatures are provided herein. The compositions include an organosilicon compound containing at least two Si-bonded hydrogen atoms per molecule, an organosilicon compound contain- ing on the average, at least two monovalent hydrocarbon radicals per molecule having aliphatic multiple bonds, a catalyst which promotes the addition of Si-bonded hydrogen to the aliphatic multiple bonds and a specified organic compound containing at least one group of the formula Image That specified organic compound inhibits curing at room tempera- ture. However, at temperatures in excess of 100 C. they cure very rapidly, Thus may easily be worked at room temperature without premature gellation. These compositions may for example be used as embedding compositions, for example for electronic components, especially during mass production with machines, as well as for machine-operated immersion coatings. The long "pot- life" achieved using the compositions of aspects of this inven- tion even at higher temperatures, is of great advantage whcn the compositions are used as sealants, adhesives, encapsulating agents, for molding objects including cable-end closures, for coatings which repel adhesive substances, i.e. paper coatings, as coating for fabrics, as well as in the manufacture of electri- cal heating elements.

328570

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