Thermosetting phenol-formaldehyde resins

C - Chemistry – Metallurgy – 08 – G

Patent

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C08G 8/10 (2006.01) B22C 1/22 (2006.01) C08J 3/11 (2006.01) C08L 61/10 (2006.01) C08L 97/02 (2006.01) C09J 161/06 (2006.01)

Patent

CA 1054293

ABSTRACT OF THE DISCLOSURE Thermosetting pheno-formaldehyde resins having novel structures and properties are described. The resins are formed at a mole ratio of formaldehyde to phenol of above 1.7:1 in an aqueous reaction medium. The resins form acid-catalyzed, room- temperature stable and mobile resins which may be applied as is onto substrates for the formation of molded articles, such as rice husk boards.

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