Thermosetting phenolic resin composition

Details Thermosetting phenolic resin composition Thermosetting phenolic resin composition

C - Chemistry, Metallurgy

08

K

C08K 5/5317 (2006.01) C08G 8/28 (2006.01) C08K 5/5353 (2006.01) C08L 61/04 (2006.01) C08L 61/14 (2006.01)

Patent

CA 2260987

This invention relates to a resin composition capable of being thermally cured having both a long pot life at low temperatures and a fast curing rate at higher temperatures containing a mixture of (a) a phenol- formaldehyde resole resin, and (b) a latent curing agent selected from a particular class of nitrogen-containing acidic phosphorus compounds made from either phosphoric acid or phosphorous acid.

Cette invention se rapporte à une composition à base de résine susceptible de durcir à chaud, caractérisée à la fois par un long délai d'utilisation à basses températures et par sa rapidité de durcissement à hautes températures. Cette composition contient un mélange (a) d'un résol phénol-formaldéhyde et (b) d'un agent de durcissement latent sélectionné parmi les éléments d'une classe particulière de composés phosphorés acides contenant de l'azote, obtenus à partir d'acide phosphorique ou d'acide phosphoreux.

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