Thermosetting polymer systems and electronic laminates

Details Thermosetting polymer systems and electronic laminates Thermosetting polymer systems and electronic laminates

H - Electricity

05

K

H05K 1/03 (2006.01) C08G 59/40 (2006.01) C08L 63/00 (2006.01) C09D 163/00 (2006.01) H01L 23/14 (2006.01)

Patent

CA 2373154

A resin system including at least one epoxy resin that is essentially free of nitrogen and with essentially no chain extension, and at least hardener that is mixture of at least one phenolic resin and a copolymer of an allyl functional material and maleic anhydride.

Cette invention concerne un système de résine qui comprend au moins une résine époxy sensiblement exempte d'azote et d'allongement de chaîne, et au moins un durcisseur qui est un mélange d'au moins une résine phénolique et d'un copolymère d'un matériau fonctionnel allyle et d'anhydride maléique.

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