C - Chemistry – Metallurgy – 08 – F
Patent
C - Chemistry, Metallurgy
08
F
C08F 8/00 (2006.01) C08K 5/00 (2006.01)
Patent
CA 2709888
Polymeric thermosetting systems that are formaldehyde free binder systemsand compositesutilizing such systems includea formaldehyde free binder formed one or more hydroxyl polymers and one or more hydroxyl polymer crosslinkers.
La présente invention concerne des systèmes polymères thermodurcissables qui sont des systèmes de liants sans formaldéhyde et des composites utilisant de tels systèmes, lesdits systèmes comprenant un liant sans formaldéhyde formé par un ou plusieurs polymères contenant des groupes hydroxyles et par un ou plusieurs agents de réticulation de polymères contenant des groupes hydroxyles.
Keur Matthew
Rodrigues Klin A.
Akzo Nobel N.v.
Norton Rose Or S.e.n.c.r.l. S.r.l./llp
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